Radar Reinvented.

Echodyne offers the world’s first compact solid-state true beam-steering radar for a wide range of industries and applications. Our high-performance radars work in all weather and are designed for autonomous vehicles, uncrewed aircraft & drones, and security of borders, critical infrastructure, and smart cities. The company combines the patented technology of metamaterials with powerful software to create a radar sensor with unprecedented performance at commercial price points. Echodyne offers its radars to companies working in Automotive, Transportation, Critical Infrastructure Protection, Border Security, Smart Cities, Uncrewed Aircraft Systems (UAS), and Airspace Management including Urban Air Mobility (UTM).

Principal PCB Design Engineer

Advanced Technology Development

ROLE OVERVIEW

Echodyne is seeking a Principal PCB Design Engineer to join the Advanced Technology Development team and lead physical design for demanding RF, high-speed digital, mixed-signal, and power electronics used in rapid radar prototypes and future products.

You will join a high-performing, cross-disciplinary team where senior engineers have meaningful technical ownership, run fast experiments, and see their work move directly into future radar products. You will work on prototype development, including tiled-aperture electronics, distributed beam control, modular RF and compute hardware, and fast calibration and test infrastructure.

The ideal candidate combines deep PCB design expertise with sound technical judgment, close supplier engagement, and the ability to balance electrical performance with reliable, repeatable manufacturing.

RESPONSIBILITIES

Lead PCB physical design for advanced technology prototypes, advanced test vehicles, and future high-performance radar platforms
Translate RF, antenna, analog, high-speed digital, power, mechanical, and manufacturing requirements into practical stackups, constraints, placement, routing, and interconnect solutions
Create prototype boards, coupons, and test vehicles that prove new materials, structures, fabrication methods, and assembly approaches
Collaborate with RF, electrical, mechanical, systems, manufacturing, suppliers, and key stakeholders to deliver mission-critical hardware within demanding engineering constraints
Apply modern best-practices and establish reusable guidance for design for manufacturing (DFM), design for assembly (DFA), design for test (DFT), reliability, stackups, and known layout limits
Provide Principal-level leadership through design reviews, supplier collaboration, mentoring, hands-on prototype bring-up, and transition of proven PCB solutions into product development

REQUIRED SKILLS / EXPERIENCE

Strong hands-on experience designing complex multilayer PCBs for RF, high-speed digital, mixed-signal, analog, or power applications
Advanced proficiency with Altium Designer or an equivalent PCB design platform, including constraint management, library use, fabrication outputs, and design review
Strong knowledge of stackups, controlled impedance, return paths, via structures, interconnects, laminates, finishes, tolerances, and PCB fabrication processes
Practical command of signal integrity, power integrity, EMI and EMC, thermal behavior, reliability, design for manufacturing, design for assembly, and design for test
Experience translating schematics, performance budgets, and interface requirements into manufacturable placement and routing decisions
Experience working directly with PCB fabricators, assembly suppliers, materials and process engineers, and prototype build teams
Ability to communicate design decisions, constraints, and risks clearly

DESIRED SKILLS / EXPERIENCE

(Looking for one or more as a complement to the core skills)

Experience developing PCB technologies for radar, phased arrays, aerospace, defense, sensing, or other high-reliability and mission-critical products
Experience in advanced technology development, applied research, rapid prototyping, or early hardware technology maturation