Your mission

At Q.ANT, we are building photonic processing systems that compute with light - delivering a scalable, energy-efficient alternative to transistor based architectures for next-generation AI and high-performance computing.

As Senior Integrated Photonics Packaging Engineer (m/f/d) in our PIC OPS team, you will drive the transition of Q.ANT’s photonic computing technology from R&D prototypes to miniaturized, high-performance photonic modules. Focusing on RF and electro-optical packaging, you will define, develop, and verify high-frequency packaging concepts that unite PICs, light sources, photodetectors, and analog circuitry. By managing global suppliers and innovating beyond existing design rules, you will create proprietary packaging architectures that form a core competitive differentiator for our technology.

Your Impact & Responsibilities

Define and own high-density electro-optical and RF packaging solutions, ensuring superior Signal Integrity (SI) and Power Integrity (PI)
Lead supplier - driven R&D packaging projects from technical specification and contract negotiation through to final system integration and validation
Perform electromagnetic modeling, co-simulation of package structures, and implementation of transmission line theory and EMC shielding techniques
Drive Design for Manufacturability (DFM) and PCB/package layouting using advanced packaging materials and substrate technologies (HTCC, LTCC, HDI, Build-up)
Execute thermal management strategies for high-power photonic and

high-frequency devices

Establish quality assurance and verification protocols to achieve ≥95%

first-pass qualification on supplier-delivered modules

Implement at least one new packaging material, process, or high-frequency architecture annually to build and protect proprietary Q.ANT IP
Collaborate closely with internal R&D, systems, manufacturing, and test teams to align RF packaging solutions with overall system architecture

Your profile

M.Sc. or Ph.D. in Electrical Engineering, Photonics, Optoelectronics, Physics, or a related field; equivalent ndustry experience also considered
5+ years of hands-on experience in RF packaging, optoelectronic integration, or high-density interconnect technologies
Proven track record of managing supplier-led R&D projects from requirement definition through to integration and validation
Deep expertise in RF signal/power integrity, electromagnetic simulation tools, S-parameter measurements, and EMC shielding
Solid background in semiconductor backend integration, thermal management, and advanced packaging substrates (HTCC, LTCC, HDI)
Familiarity with CAD tools for electronic packaging, statistical process control (SPC), and industry standards (e.g., Telcordia, JEDEC)
Solution-oriented mindset with high attention to detail, proactive ownership, strong self-leadership, and cross-functional communication skills
Fluent in English; knowledge of German or another European language is a plus

Why us?

Work on the leading edge: Shape deep-tech evolution by developing novel high frequency packaging architectures that push the physical boundaries of AI computing.
Make impact at scale: Transition photonics computing from prototypes to scalable, high-yield mass production, directly accelerating our time-to-market.
Broad decision-making authority: Enjoy wide autonomy to challenge existing design rules, define technical strategies, select suppliers, and propose new packaging technologies.
Fast-track your growth: Solve complex high-frequency and electro-optical challenges with few industry precedents—every solution you build contributes to industry-defining IP.
World-class team: Collaborate alongside a passionate, international team of experts in photonics, RF design, processor architecture, and AI systems.
Direct access to leadership: Work directly with the Head of PIC, company founders, and an advisory board that has shaped the semiconductor industry.