Mechanical AIT Engineer - Japan

Team: Global Manufacturing Organization – AIT Engineering

Location: Tokyo, Japan

Working model: On-site

Employment is subject to applicable security screening (incl. SUPO, where required).

Who are we?

ICEYE is the global leader in synthetic aperture radar (SAR) satellite technology, revolutionizing Earth observation with real-time, all-weather, day-and-night imaging. As the owner and operator of the world's largest SAR satellite constellation, we provide critical insights that empower industries like defense, maritime, disaster management, insurance, and finance to make informed decisions.

Headquartered in Finland and operating internationally with offices in Finland, Poland, Spain, Japan, the UAE, Greece, and the US, our diverse team of more than 900 experts from nearly 60 countries shares a bold mission: to enhance life on Earth by delivering reliable, data-driven solutions. At ICEYE, we foster a culture of curiosity, innovation, and collaboration, pushing the boundaries of what's possible in space technology to solve the world's toughest challenges.

Why Join ICEYE?

At ICEYE, we're not just launching satellites — we're redefining what's possible with SAR technology. Join a team of passionate innovators solving real-world challenges and making a tangible impact. We foster a dynamic and inclusive environment where your ideas are valued, your growth is supported, and your contributions truly matter. With continuous learning opportunities, cutting-edge projects, and collaboration with industry-leading experts, you'll have the chance to grow, innovate, and shape the future of Earth Observation.

What will you do in this role?

ICEYE is seeking a Mechanical AIT (Assembly, Integration & Testing) Engineer to own the mechanical side of production end to end -- integration, testing, supplier selection, continuous improvement, and adapting processes as new designs come through. In this role, you will be the technical expert responsible for satellite mechanical integration and vibration testing, ensuring that the structure, payload, solar arrays, propulsion and thermal hardware come together as a flight-ready unit that survives launch. You will act as the primary technical contact for mechanical integration issues and drive improvements in build cycle time, test efficiency and build reliability, ensuring every spacecraft meets ICEYE’s high standards for reliability and mission success.

Key Responsibilities

Lead the mechanical integration of the satellite (structure, payload, solar arrays, propulsion, harness routing, thermal hardware), including torque control, bonding, alignment and mass properties measurements

Own vibration test campaigns end to end: test specification, fixtures, instrumentation, execution, data analysis and reporting, with test levels and FEM correlation defined together with Structures Engineering

Act as primary technical contact for mechanical integration issues, performing root cause analysis on nonconformances and coordinating with Mechanical/Structures Engineering to resolve anomalies

Survey, evaluate and select suppliers and test facilities for mechanical parts, MGSE and fixtures, including audits and first article inspections

Contribute to and improve AIT documentation, including mechanical integration procedures, test plans and as-built configuration records

Interface with Global AIT, Mechanical/Structures Engineering, QA and Launch teams to ensure alignment on product standards and lessons learned

Drive continuous improvement and automation in mechanical integration methods, test data processing and build cycle time

Requirements & Qualifications

3+ years of hands-on experience in mechanical assembly, integration or testing of complex systems, preferably in aerospace or high-reliability hardware industries

Hands-on experience planning and executing vibration testing (sine, random, shock), including fixture design, accelerometer instrumentation and test data analysis

Solid understanding of spacecraft mechanical architecture: structures, fasteners and torque control, bonding, alignment, mass properties and thermal hardware