About Rosaic Labs

Rosaic Labs builds full-platform systems for the agentic AI world: the silicon and software behind what's next. Founded by investor and entrepreneur Amarjit Gill and Peter Bannon, former VP of Engineering at Tesla, we design AI chips and the software that runs on them.

Our team brings together veterans from leading Silicon Valley companies and is growing fast. We are headquartered in Santa Clara, CA, with an office in Austin, TX, and more on the way.

About the role

We are looking for an experienced Thermal Engineer to own the cooling design of our server solutions, from concept through validation. You will develop air and liquid cooling architectures, model them with CFD, and prove them out in the lab by correlating test data against simulation.

This is a hands-on, cross-functional role. You will work closely with electrical, mechanical, and package engineers to balance thermal performance against power, layout, mechanical, and you will bring a working knowledge of data center architecture and the cooling ecosystem offered by suppliers.

Key responsibilities

Define and design thermal solutions for servers and rack-level systems, including heat sinks, cold plates, fans, airflow management, and liquid cooling loops.
Run system- and component-level CFD simulations to evaluate design options, predict component temperatures, and guide layout decisions early in development.
Plan and execute full-system thermal chamber tests, using thermal test vehicles where needed, and correlate results against simulation models to refine accuracy.
Partner with electrical engineers on power maps, board layout, and component placement to manage hot spots.
Work with mechanical engineers on enclosure, airflow paths, fan placement, and integration of cooling hardware.
Collaborate with package engineers on die- and package-level thermal characteristics, thermal interface materials, and junction temperature targets.
Evaluate and qualify cooling solutions from suppliers (heat sinks, cold plates, CDUs, manifolds, fans), and drive technical alignment with vendors.
Translate data center requirements (rack density, inlet temperatures, airflow, facility water conditions) into server-level thermal specifications.
Develop thermal control strategies and thermal margins together with firmware and system teams.
Document design reviews, test reports, and thermal specifications, and present findings to cross-functional stakeholders.

Required qualifications

Bachelor's degree in Mechanical Engineering, Aerospace Engineering, or a related field.
7+ years of experience designing thermal solutions for servers, storage, networking, or similar high-power electronic systems.
Proven record of taking cooling designs from concept through validation and production.
Strong hands-on experience with CFD tools for electronics cooling.
Experience planning thermal tests and correlating measured data with simulation results.
Solid grasp of heat transfer, fluid mechanics, and thermodynamics fundamentals.
Working knowledge of data center architecture, including rack layouts, hot/cold aisle containment, and facility cooling infrastructure.
Familiarity with air and liquid cooling solutions available from industry suppliers.
Effective communicator who works well across electrical, mechanical, and package engineering teams.

Preferred qualifications

Master's or PhD in a thermal-fluids discipline.
Experience with direct-to-chip liquid cooling, immersion cooling, or rear-door heat exchangers.
Background cooling high-power CPUs, GPUs, or AI accelerators.
Experience with thermal test instrumentation such as thermocouples, flow meters, IR cameras, and data acquisition systems.
Experience working directly with cooling suppliers and contract manufacturers.