HRL Laboratories, an IBM company, pioneers the next frontiers of physical and information science. Delivering transformative technologies in automotive, aerospace and defense, HRL advances the critical missions of its customers to help them remove limitations and create competitive advantage. HRL then transitions the work back to customers – ready for real-world application. For more than 70 years, HRL’s rich portfolio of scientific discoveries and engineering innovations continues to build on each other — often in unexpected, profound and far-reaching ways. As a private company owned by IBM, HRL prioritizes purpose over profit, significantly advancing the state of the art.

HRL Laboratories develops radiofrequency, millimeter-wave and electro-optical sensors using state-of-the-art materials and device fabrication processes to deliver agile, mission-ready systems. Our high-performance solutions are highly integrated, architecturally low cost, and optimized for size, weight and power efficiency while leveraging commercial, custom and novel mixed-signal innovations.

HRL’s Sensors and Electronics Lab is looking for a mechanical engineer to help develop pioneering RF technologies in a mission-focused environment. Candidate will be expected to work within diverse teams taking responsibility for the design, FEA modeling, implementation, and integration of mechanical and thermal solutions for advanced RF prototypes. While primarily focused will be on the mechanical and thermal design, a strong candidate should possess a well-rounded skill set in mechanical, electronics, and programming areas and will be required to support and assist senior staff scientists and engineers in the product development cycle.

Key Responsibilities

Work with RF and electrical engineering teams to design, simulate, integrate, and test mechanical and thermal assemblies to meet customer requirements
Perform simulations of mechanical systems (FEA of CAD components and assemblies) and electronics systems (SPICE simulations) for electronics and RF subsystems
Prepare design specifications, component drawings, assembly drawings, tolerance analysis and interface control documents with application of GD&T and develop system assembly instructions
Integrate and validate system hardware in a laboratory environment
Contribute to software development to monitor, control, and acquire data from and RF subsystems
Support design reviews and implement design for manufacturing/assembly principles
Perform or coordinate fabrication and testing of assemblies

Required Qualifications

Bachelor’s or master’s degree in mechanical engineering or relevant field
At least 4 years of experience designing, implementing, and testing mechanical assemblies and/or thermal management systems
Proficient with SolidWorks to create detailed 3D models and technical drawings of components and assemblies
General knowledge of GD&T is required and how it relates to processing methods
Experience with FEA analysis tools such as Ansys or COMSOL
Working knowledge of mechanical and thermal design principles from the component to subsystem level, including operation, controls, safety, etc.
Understanding of structural and thermal analysis and fluid dynamics
Familiarity with MILSPEC standards and qualification of hardware for DoD applications
Proficiency in use of computers, engineering workstations, complex electronic equipment, oral and written communication, interaction with vendors/colleagues and willingness to work in a fast-paced, deadline-driven environment.
Ability to work well in a team and independently
Working knowledge of electronic parts and components, including connectors, cables, printed circuit boards and device packages

Preferred Qualifications

Understanding of ASME Y14.5 and ASME Y14.100
Basic understanding of electronic and/or RF components and systems
Product life cycle, vibration, environmental testing experience