Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities.

Tenstorrent is building a high-performance AI platform that brings together software, compilers, platforms, networking, and semiconductors. The team values collaboration, curiosity, and solving hard problems. We are seeking a Staff Mechanical Design Engineer to lead mechanical and thermal productization for next-generation multi-chip AI servers and advanced data center hardware. You will guide high-density system programs from concept through volume production, working across engineering, manufacturing, and supplier teams.

This role is hybrid, based out of Toronto, Canada.

We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

Who You Are

You hold a bachelor’s or master’s degree in Mechanical Engineering or a related technical field, with 10+ years of experience designing enterprise servers, HPC systems, or specialized AI hardware.
You have architected high-density server enclosures and rack-level systems, including 1U–4U platforms, OCP standards, or EIA racks, and have integrated air cooling, cold plates, and liquid-cooling solutions.
You are highly proficient in 3D CAD, preferably SolidWorks, and large-assembly management, with experience in sheet metal, complex surfacing, routing, and wire harness design.
You bring expert knowledge of high-volume manufacturing processes—including stamping, die casting, extrusion, and injection molding—as well as rapid prototyping, GD&T, tolerance stack-up analysis, and production-ready drawings.
You are analytical and hands-on, able to make data-driven design decisions, lead cross-functional reviews, and travel internationally up to 10–15% for supplier visits, factory bring-ups, and design reviews.

What We Need

Architect mechanical and thermal design strategies for high-power AI compute systems, including dense multi-chip server chassis, rack integration, and advanced PCIe accelerators; help define board layouts, power constraints, and thermal envelopes with electrical, thermal, SI/PI, and system architecture teams.
Lead structural and reliability analysis, including FEA, PCB microstrain validation, and shock and vibration assessment; define product-level testing for vibration, shock, thermal cycling, and environmental conditions.
Evaluate and introduce mechanical and thermal technologies that support rising AI power requirements while meeting data center and applicable regulatory standards.
Define and drive DFM and DFA strategies with ODMs, contract manufacturers, suppliers, tooling vendors, and test labs to improve manufacturability, assembly, yield, quality, and cost at scale.
Own technical execution across the product lifecycle: manage system BOMs in PLM, lead supplier and manufacturing readiness, conduct rigorous design reviews, establish engineering best practices, and mentor junior and mid-level engineers.

What You Will Learn

How to shape the mechanical architecture of next-generation AI servers and data center hardware from early concepts through volume production.
How mechanical design, thermal management, power delivery, board constraints, and system architecture come together in high-density, high-TDP platforms.
How simulation, reliability testing, supplier development, and manufacturing processes inform resilient, scalable server and rack designs.