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OpenAI

Thermal Engineer

San FranciscoUnited States
FullTime · Scaling
POSTED 12 NOVVERIFIED 8M AGO
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Role
0 days opentrue age
Closes in ~46d at the median (46d)
Posted 12 Nov · n=97
Payats field
$266k–445kposted
▲ +78% vs market median $200k
$161k$445k
Market p25–p75
$161k–$240k
OpenAI p25–p75
$287k–$366kn=140
H-1B median · Software engineering
$264k
SF Bay Area · n=2174 · 365d to 12 Nov
CompanyOpenAI →
824open roles
Opened · 30d
+106
Closed · 30d
−78
12d of snapshots · 30d window
Market
37,769open · Software engineering
Opened · 7d
+3,93310% of open
All software engineering
75,408open
All tracked boards · live 12 Nov · n=37,769
Visa
210H-1B LCAs · FY26
PERM · FY26
1
Median wage
$260k
UK licensed sponsor
✓Worker (A rating)
LCAs FY26 · n=210 · to 2026-06-30

About the Team

OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI.

About the Role

We are looking for an experienced Thermal Engineer with 7+ years of experience in thermal management of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of thermal solutions that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment.

Key Responsibilities

Design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures

Evaluate thermal performance at the chip, package, and board levels, addressing challenges related to power density, heat dissipation, and thermal interface materials

Perform thermal modeling and simulation to predict temperature profiles and identify thermal bottlenecks

Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production

Support lab testing and validation, including the setup of thermal experiments, data acquisition, and troubleshooting of thermal performance issues

Design and select thermal components, such as cold plates, heat sinks, fans, vapor chambers, and thermal interface materials (TIMs)

Work with firmware and electrical engineers to define and implement thermal control algorithms for dynamic power and cooling management.

Conduct feasibility studies and trade-off analyses to evaluate cooling technologies and improve system thermal efficiency

Partner with suppliers and manufacturers to support the development of custom thermal components and ensure quality in production

Qualifications

Bachelor’s degree in Mechanical Engineering, Thermal Engineering, or a related field (Master’s preferred).

7+ years of industry experience in thermal design, simulation, and validation for IT hardware

Proficiency in thermal simulation software and CAD tools

Strong understanding of heat transfer principles, thermodynamics, and fluid mechanics, with an emphasis on electronics cooling

Hands-on experience with thermal testing equipment, including thermocouples, infrared cameras, wind tunnels, and P-Q characterization setups

Experience in chip/package-level thermal analysis, including die-level heat spreading, and package thermal modeling

Ability to analyze experimental data, identify root causes of thermal issues, and implement corrective actions

Strong problem-solving skills, with the ability to perform first-principles calculations to support design decisions.

Self-driven, detail-oriented, and able to work independently or collaboratively in cross-functional engineering environments

Preferred Skills

10+ years of industry experience in thermal design, simulation, and validation for IT hardware

Extensive experience with data center hardware or high-performance computing systems at scale

Practical experience in developing advanced cooling technologies

Familiarity with thermal control algorithms and dynamic thermal management techniques

Understanding of reliability testing, failure analysis, and thermal stress testing for electronic components

Experience working with suppliers and manufacturing partners to support thermal solution development and production ramp-up

To comply with U.S. export control laws and regulations, candidates for this role may need to meet certain legal status requirements as provided in those laws and regulations.

Source · OpenAIFirst seen 12 NovOriginal ↗