About OLIX

AI is growing faster than any technology in history and the explosion in demand has created a massive infrastructure gap; we can no longer build chips or power stations fast enough to keep up. The industry is still leaning on a ten-year-old hardware blueprint that has reached its limit. A new paradigm that is faster and more efficient will be the biggest economic opportunity of the next century and create the most important company of the next decade. The OLIX Decode Accelerator 1 (DX-1) is the first accelerator architected specifically for decode. Rack-scale co-design of logic, data movement, packaging, optics and interconnect enables a step change in system level performance.

The Role

At OLIX, the performance of our technology depends not only on silicon design, but on how effectively that silicon is packaged, integrated, and scaled into products. Packaging is a first-class element of our rack-scale co-design philosophy, and over successive product generations it will become one of our most important sources of system-level differentiation.

The Advanced Packaging Architect will own OLIX's packaging technology direction: defining the packaging architecture and roadmap across current and future products, and delivering the packaging solutions that turn our ASICs into high-performance systems.

The DX-1 provides the foundation, with a well-bounded packaging scope that must be executed to a high standard on an aggressive schedule. Beyond DX-1, our roadmap moves rapidly toward significantly more advanced packaging, with the potential for denser multi-die and chiplet-style integration, 2.5D and 3D architectures, and progressively more advanced optical integration. This role shapes that trajectory and lays the foundation for future products that will fast-follow DX-1.

This is a high-impact role combining hands-on engineering with architectural and strategic ownership. You will lead packaging across the full development flow for DX-1, including package architecture, detailed design, layout, simulation, and product readiness, while simultaneously defining the packaging technology strategy, partner ecosystem, and internal capability that future generations will require. As the programme scales, you will have the opportunity to build the packaging function and team around you.

Responsibilities

Advanced Package Architecture & Design

Own package architecture and design for ASIC-to-substrate integration, including bump/pad mapping, substrate escape, interconnect strategy, package floorplanning, and stack-up definition

Lead the development of 2.5D and 3D package architectures for future OLIX product variants, including multi-die integration, chiplet-style interfaces, and heterogeneous integration approaches

Define package structures that meet electrical, thermal, mechanical, reliability, and manufacturability requirements

Translate silicon and system requirements into practical package design rules, routing constraints, and implementation strategies

Full Package Design Flow

Own or direct the full package design flow, from concept definition through detailed design, analysis, layout, verification, release, and manufacturing support

Develop and review package layouts including die placement, substrate routing, power/ground distribution, high-speed interface breakout, and physical integration constraints

Own or direct PI/SI simulation activities to validate signal integrity, power delivery, and package performance, translating results directly into design improvements and sign-off decisions

Support package-to-board co-design, including substrate layout and PCB layout/interface definition where required

Ensure strong alignment between die, package, substrate, and board-level implementation

Oversee package database management, design reviews, sign-off, and release readiness

Capability & Team Building

Establish OLIX's packaging engineering capability: methodologies, design libraries, templates, rules, tool flows, and workflows that support efficient and repeatable development across product generations