About Odys

At Odys, we’re mobilizing power, with Hybrid Power Systems developed for aerospace and in-demand everywhere. It’s the kind of mission diversity that demands a fresh way of thinking.

We began with an early bet on hybrid, when the mobility industry was focused on batteries. We designed, tested, and validated our first 1 MW high-speed generator in 12 months. And then we pushed further, developing systems with greater power density in less time. Today, our Hybrid Power Systems offer outputs ranging from 20 kW to 4 MW, with applications in the air or on the ground.

One of those applications is Laila, an unmanned drone designed for critical logistics and defense missions. With its 100 kW-class onboard Hybrid Power System, Laila can support medical cold-chain transport or serve as an aerial platform for counter-UAS measures.

The market interest has been overwhelming: Over 30 inbound requests from leading US and global manufacturers, and 14+ DoD contracts.

Our team comes from deep tech and aerospace, with backgrounds spanning drone and aircraft development, high-volume production, and electrified mobility.

We operate with urgency and ownership at every level. We validated high-speed generator technology faster than our peers, not because we skipped steps, but because we've been doing this long enough to know which ones matter most.

Creating the future of power, in the air and on the ground, is a challenge we’ve been training our entire lives for. If that sounds like you, this is the opportunity you’ve been waiting for.

Odys Aviation is at the forefront of developing hybrid-electric aircraft to enable sustainable regional air travel. As the Sr. Power Electronics Hardware Engineer, you will be responsible for the design and development of our SiC-based propulsion power electronics - motor drives, active rectifiers, and DC/DC converters - supporting both the Laila (UAV) and Alta (Hybrid-electric VTOL) programs.

This role focuses on hardware design and physical realization. You will be tasked with architecting and delivering high-power-density SiC converter stages from concept through flight hardware, including schematic capture, PCB layout, magnetics, gate-drive and protection circuitry, thermal management, and EMI mitigation. Control algorithms, embedded firmware, and HIL infrastructure will remain with peer engineers; your responsibility is to deliver hardware that meets electrical, thermal, mechanical, and certification targets, and that enables the control system to extract full performance.

The primary deliverable is a propulsion power electronics stack that achieves aerospace-grade reliability, hits aggressive power-density and efficiency targets, and is manufacturable, testable, and robust under the full envelope of flight conditions.

Responsibilities

Architect and design SiC-MOSFET-based motor drives, active rectifiers, and DC/DC converters operating at switching frequencies greater than 20–40 kHz, with focus on power density, efficiency, and reliability for airborne applications.

Lead schematic capture and PCB layout (Altium, Cadence, or equivalent) for high-voltage, high-current power stages, including controlled-impedance routing, creepage and clearance per aerospace standards, and partitioning of power, signal, and gate-drive domains.

Design gate-drive circuits tailored to SiC device physics, including isolated drivers, dv/dt and di/dt management, desat and short-circuit protection, miller-clamp strategies, and dead-time selection in coordination with the controls engineer.

Design magnetic components - DC-link inductors, common-mode and differential-mode chokes, current sensors, and isolation transformers - including core selection, winding strategy, loss budgeting, and saturation analysis for high-frequency operation.

Develop DC-link architecture and capacitor banks, including ripple-current budgeting, ESR/ESL management, lifetime analysis, and pre-charge/discharge circuitry.

Lead thermal design of converter assemblies, including heatsink and cold-plate selection, junction-to-coolant thermal stack-up, transient thermal analysis, and coordination with mechanical engineering on cooling integration.