What MatX is Building

MatX is building next-generation AI compute infrastructure purpose-built for large-scale LLM training and inference. We are looking for a Mechanical Engineering Lead to own the mechanical design, thermal architecture, and system integration of our rack-scale AI platform from concept through production. This is a hands-on leadership role. You will drive the mechanical design of our AI compute trays, ORV3/ORW rack systems, and fully liquid-cooled infrastructure, working closely with hardware, thermal, electrical, and JDM/ODM partners to bring a world-class AI data center platform to life.

What You'll Do Here

Own mechanical design of AI compute trays, rack enclosures, and full rack-scale systems from concept through production, built to OCP standards — covering structural design, sheet metal, extrusions, castings, and rack-level integration.

Direct mechanical engineers on 3D models and 2D drawings for every component and assembly (DFMA-based datum schemes), and run tolerance stack-ups to define IQC, IPQC, and OQC criteria across EVT, DVT, and PVT.

Own rack-level integration (power distribution, cable management, blind-mate connectors, backplane interface, tray insertion/extraction) and packaging design, partnering with JDM/ODM to refine both.

Lead liquid cooling design and qualification — cold plates, manifolds, CDU interfaces, QD fittings — from components through L10/L11/L12 validation; partner with thermal engineering on cooling architecture and leak detection.

Champion DFM/DFA practices, drive 100% functional test coverage, and guide reliability testing, RMA, and failure analysis.

Serve as lead mechanical point of contact for JDM/ODM — running DFM/qualification reviews, owning BOM and drawings, and authoring DVT/PVT test plans (structural, vibration, shock, thermal, prototype builds).

Ensure designs meet OCP, ASHRAE, and IEC standards; build and mentor the mechanical/thermal team while managing schedules and risk alongside TPM.

Who You Are

15+ years of mechanical engineering experience in server, data center, or AI compute hardware, with hands-on experience designing mechanical components, sub-assemblies, and assemblies at the tray and rack level

Experience leading mechanical teams to design rack-scale hardware: compute trays, rack enclosures, or server platforms delivered to OCP Open Rack standards

Experience in volumetric analysis, stack tolerance analysis, and FEA analysis

Experience integrating liquid cooling systems (cold plates, manifolds, CDU interfaces) into the whole architecture

Experience generating DFMA with sheet metal, extrusion, casting, and machining manufacturing processes

Experience in sustainable manufacturing compliance, and design of fixtures and test setups for multiple applications (in-process testing, reliability testing, functional testing)

Experience leading the ODM/JDM in setting up an assembly line through EVT, DVT, PVT, and MP phases

Bonus Points

Experience with high-power AI accelerator platforms

Prior experience designing for OCP ORV3 or Open Rack Wide (ORW) platforms, or direct involvement in an OCP contribution/workstream.

Hands-on experience with direct-to-chip liquid cooling at rack scale — cold plate design, manifold routing, QD fitting selection, and CDU integration for high power racks.

Experience taking a mechanical design through high-volume manufacturing with JDM/ODM partners in Taiwan or China, including on-site NPI support.

Familiarity with rear door heat exchanger (RDHx) integration as a complement to DLC for residual thermal load.

Compensation

The US base salary for this full-time position is determined based on a variety of factors including role, experience, location, job-related skills, and relevant education and training. Career length is only a guideline for compensation.

Early Career - $160,000 - $275,000 + equity

Mid Career - $175,000 - $400,000 + equity

Senior Career - $250,000 - $600,000 + equity

What We Offer

Time off: 4 weeks PTO (accrued) + 12 company Holidays + up to 3 weeks remote work