Roles & Responsibilities

Lead the New Product Introduction (NPI) effort to develop in-house test solutions, including managing the tester RFQ (Request for Quotation) process

Own the transfer of qualified test solutions into High Volume Manufacturing (HVM), ensuring smooth handover and production readiness

Partner with design, process, and packaging engineering teams to define test requirements and specifications for silicon photonics products

Evaluate, select, and manage relationships with test equipment vendors and suppliers

Drive test yield improvement and cost-of-test reduction initiatives across the product lifecycle

Establish and maintain test methodologies, standards, and documentation to support scale-up and manufacturing transfer

Manage project timelines, budgets, and resources for test development programs

Lead and develop a team of test and packaging engineers

Collaborate with cross-functional stakeholders (R&D, operations, quality, and supply chain) to ensure alignment on product qualification milestones

Provide technical guidance on packaging and test integration challenges specific to silicon photonics devices

Requirements

Bachelor's or Master's degree in Electrical Engineering, Photonics, materials, or a related field

Minimum 10 years of experience in photonics test/packaging engineering, with at least 5 years in a managerial or leadership capacity

Proven track record in NPI, test solution development, and HVM transfer within the photonics industry

Strong understanding of silicon photonics packaging and test processes (e.g., optical alignment, wafer-level/final test, wire bonding, or fiber attach)

Experience managing tester RFQ processes and vendor negotiations

Strong project management, cross-functional collaboration, and stakeholder management skills

Excellent leadership and people management capabilities